W2P SolFlex 650 3D Resin Printer
Technology | UV-LED DLP, Wavelength 385 nm | |
Max. Print Volume | 128 x 120 x 130 mm | |
Layer Thickness | 25-200 µm | |
Operating Temperature | 18-28 °C | |
Building Speed | 120 mm/h | |
Apropriate Materials | W2P Suggested Materials, UV-curing systems |
Ansprechpartner: M.Sc. Nico Geis
Telefon: +49(0)921 55 75 18
Telefax: +49(0)921 55 74 73
Email: nico.geis@uni-bayreuth.de
