Highly filled polymers for electronic circuits


Materials for substrates of printed circuit boards are nowadays used in many applications, as for radio, television, telecommunication, emitter, receiver, antenna and radar technologies. In high frequency ranges (up to 300 GHz) especially a low loss and high clock rates of the electronic signal are needed, which can be achieved with a low loss factor (< 0.01) and a low dielectric constant (< 4). With such HF materials it is possible to increase the packing density of electronic elements and also to the clock rate, which leads to space-savings and to a performance enhancement of this assembly group.

Many thermoplastic polymers fulfil these requirements and enable a highly economic fabrication with conventional processing methods, such as extrusion or injection moulding technology. But there are some other requirements to printed circuit boards, as a low coefficient of thermal expansion (CTE). For this reason it is necessary to modify these polymers with ceramic fillers. The challenge in the actual research projects is especially to decrease clearly the CTE, but at the same time to achieve a sufficiently low processing viscosity and a sufficiently low brittleness for thin substrates (0.4 mm thickness).

Contact: Dipl.-Ing. Stefan Mörl
Phone: +49(0)921 55 74 72
Fax: +49(0)921 55 74 73
Email: stefan.moerl@uni-bayreuth.de

Highly filled polymers