Konferenzbeiträge
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Back injection molding of FR4 with heat conductive polymers Konferenzbeitrag In: Author(s), 0000. DOI: 10.1063/1.4965461 |
Electrospun Nanofibers of High Performance Electret Polymers Konferenzbeitrag In: Cambridge University Press (CUP), 0000. |
Polymerschäume – Perspektiven und Trend Konferenzbeitrag In: 0000. |
Mechanical properties of epoxy nanocomposites modified with nano-silica for high voltage applications Konferenzbeitrag In: 29th Polymer Processing Society (PPS-29), 0000. |
Fatigue Crack Growth Behavior of Multiphase Blends Konferenzbeitrag In: S. 417–427, Japan Society of Mechanical Engineers, 0000. DOI: 10.1299/jmmp.2.417 |
New techniques for the development of cellular films for electret and piezoelectric applications Konferenzbeitrag In: 2008 13th International Symposium on Electrets, IEEE, 0000. |
Influence of the polymer chemical structure on the charge storage of polymer blends Konferenzbeitrag In: 2008 13th International Symposium on Electrets, IEEE, 0000. |
Charge storage of compact and fibrous blends based on polyphenylene ether Konferenzbeitrag In: 2008 13th International Symposium on Electrets, IEEE, 0000. |
Influence of chemical structure of bisamide additives on charge storage properties of isotactic polypropylene Konferenzbeitrag In: 2008 13th International Symposium on Electrets, IEEE, 0000. |
Additives to Improve the Electret Performance of Polypropylen Konferenzbeitrag In: 2008 13th International Symposium on Electrets, IEEE, 0000. |
Synthesis and characterization of fluorinated poly(ether imide)s and their application as electret materials Konferenzbeitrag In: 2008 13th International Symposium on Electrets, IEEE, 0000. |
Deformation of Inclusions and Lamellae during Melt Elongation of Blends of a Styrene-Butadiene Block Copolymer with Polystyrene Konferenzbeitrag In: AIP Conference Proceedings, AIP, 0000. DOI: 10.1063/1.2964754 |
Lignin as renewable raw material for applications in electronics Konferenzbeitrag In: Author(s), 0000. DOI: 10.1063/1.4965524 |
2nd Generation Layered Silicates Nanocomposites with improved Mechanical and Electrical Properties Konferenzbeitrag In: S. 1728–1734, American Chemical Society (ACS), 0000. DOI: 10.1021/cm960127g |
Charge decay of electron-beam irradiated Polypropylene films containing additives Konferenzbeitrag In: 2008 13th International Symposium on Electrets, IEEE, 0000. |
Determination of adhesion between thermoplastic and liquid silicone rubbers in hard-soft-combinations via mechanical peeling test Konferenzbeitrag In: American Institute of Physics, 0000. DOI: 10.1063/1.4873751 |
Foam injection moulding of a TPO/TPC-blend and the effect of different nucleating agents on the resulting foam structure Konferenzbeitrag In: American Institute of Physics, 0000. DOI: 10.1063/1.4873802 |
INFLUÊNCIA DA ABSORÇÃO DE BIODIESEL NAS PROPRIEDADES DA BORRACHA NITRÍLICA Konferenzbeitrag In: Anais do XX Congresso Brasileiro de Engenharia Química, Editora Edgard Blücher, 0000. |
Welcome Remarks by the Chairman of "The 29th International Conference of the Polymer Processing Society" Konferenzbeitrag In: AIP Conference Proceedings 1593, 2, American Institute of Physics, 0000. DOI: 10.1063/1.4873723 |
Tailored benzoxazines as novel resin systems for printed circuit boards in high temperature e-mobile application Konferenzbeitrag In: American Institute of Physics, 0000. DOI: 10.1063/1.4873870 |
Foam injection molding of thermoplastic elastomers: Blowing agents, foaming process and characterization of structural foam Konferenzbeitrag In: American Institute of Physics, 0000. DOI: 10.1063/1.4873809 |
Concepts of particle foam based ultralight automotive interior part Konferenzbeitrag In: American Institute of Physics, 0000. DOI: 10.1063/1.4873799 |
Surface modification of polypropylene based particle foam Konferenzbeitrag In: American Institute of Physics, 0000. DOI: 10.1063/1.4873804 |
Hitzebeständige 2K-Verbunde Konferenzbeitrag In: S. 134-137., 0000. |